Responsibilities:
- Apply materials expertise and technical skills to design, develop, and specify the materials application to the plasma/etch chambers and the chamber components.
- Evaluate and develop plasma/etch processes related products to meet market requirements and provide detailed feedback on results to other groups for development work as a whole team.
- With supervision interact with customers, to analysis and solve materials and plasma related product issues, to improve or re-function of the products to meets the technical spec.
- Work with other team engineers to develop success criteria for improved components and fabrication methods, and make the smooth transfer of new component design to manufacturing.
- Generate internal documentation for products, presentations and technical reports. Review process safety requirements for all operations supervised.
Requirements:
- Solid background in Materials, Physics and chemistry of chemical reactions. Strong technical understanding of semiconductor fabrication process and integrated process flow.
- Strong problem solving and trouble shooting skills - demonstrated ability to solve complex process and equipment engineering issues with minimal supervision.Ability to acquire skills necessary to assembly, service and troubleshoot process equipment.
- Ability to work with external and internal partners in a multi-tasking environment with changing priorities. Excellent written and verbal communication skills
- Ph.D. or M.S. in science or engineering field related to semiconductor processing (such as Material science, Physical chemistry, Chemical engineering, ...).
联系人：苏兴才（873校友），XingcaiSu@amecnsh.com， xingcai.su@gmail.com,